For a leading customer in the semiconductor industry, we developed a custom wafer transfer module for square 310 mm wafers, focused on precision handling and reliable automation. The system was designed to enable the transfer of wafers from a FOUP to downstream processing with high position accuracy.

Our solution integrates a robot handling unit with linear motion capabilities to ensure smooth and accurate wafer pick-and-place operations. In addition, a dedicated positioning mechanism was implemented to align wafers with micrometer-level accuracy, while compensating for positional tolerances within the system. Special attention was given to synchronization between sub-systems and to maintaining alignment throughout the transfer process. The result is a robust and adaptable module that supports consistent wafer handling in demanding environments.

A key aspect of the project was the development of a detailed tolerance analysis and budget allocation across the full system. This was complemented by a calibration approach using a vision-based system, enabling accurate detection and compensation of positional and alignment deviations. Together, these measures ensured that the required micrometer-level accuracy could be consistently achieved under varying operating conditions.